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Flux AMTECH-NC-559-ASM – ORIGINAL
Kualitas OKE PUNYA
Exceptional print definition
Long stencil life
Wide process window
Excellent wetting compatibility on most board finishes
Compatible with enclosed printing heads
AMTECH manufactures a low-oxide, spherical and uniformly sized powder. NC-559-ASM is available in the following alloys: 63Sn/37Pb,62Sn/36Pb/2Ag, 60Sn/Pb40,43Sn/43Pb/14Bi, 42Sn/58Bi, 10Sn/88Pb/2Ag and 10Sn/90Pb.
The following packaging options are available for stencil printing and dispensing applications: 250g and 500g jars; 250g and 700g cartridges;750g ProFlow® cassettes; 35g and 100g syringes; 2,500g FreshMix® Kits.
Printing applications: 900 to 1,200Kcps +/-10%
Dispensing applications: 425Kcps +/-10%
Tested according to IPC-TM-650
Typical tackiness: 54g force
The print definition of NC-559-ASM is ideal for fine pitch applications. The stencil life of this no-clean product virtually eliminates waste of solder paste. Consult the powder distribution chart to determine your mesh size requirements.
The following are general guidelines for stencil printer optimization with NC-559-ASM. Some adjustments may be necessary based on your process requirements.
Print Speed: 25–100mm/sec
Squeegee Pressure: 0.2–0.7kg/inch of blade
Under Stencil Wipe: Once every 10–25 prints or as necessary
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well.
Storage and Handling Procedures
Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months. Syringes & cartridges should be stored vertically with the dispensing tip down. Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE.